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NEWS RELEASES, PRODUCTS, EVENTS
NEWS RELEASES EDITED AND PUBLISHED BY LAURENCE MANCINI EDITOR AT ELECTRONICSTALK
ELECTRONICSTALK is member of PRO-TALK Ltd
Keyboard and mouse chip takes protection onboard The SWKBM-16QS is billed as the first RoHS-compliant single-chip keyboard and mouse device to incorporate ESD protection and EMI/RFI filtering. Semiconwell has developed the SWKBM-16QS, the first RoHS-compliant single-chip keyboard and mouse device to incorporate ESD protection and EMI/RFI filtering. The SWKBM-16QS is designed specifically for the ruggedised and embedded industrial computer market. The Semiconwell single chip solution is cost effective, and saves board space by eliminating the use of five capacitors, four pull-up resistors and 10 diodes. It increases reliability, reduces weight and is environmentally friendly being lead free. Samples are available now. The SWKBM-16QS is priced at US $0.61 in 100,000-unit quantities and $1.147 in 5000-unit quantities. Production lead time is 4-6 weeks ARO.
Semiconwell has signed Passelec to market and distribute its integrated passive networks products in France
Thin film expertise supports French sales Semiconwell has signed Passelec to market and distribute its integrated passive networks products in France. Semiconwell was attracted to Passelec because of its experience in thin film passive components market, sales, marketing and technical resources. Passelec will be servicing existing accounts, and will concentrate on winning new designs in automotive, instrumentation, military, medical and audio applications.
Synerdyne has been signed to market and distribute Semiconwell integrated passive networks products to Japan. Semiconwell was attracted to Synerdyne because of its experience in thin film passive components market, technical resources and high levels of market penetration in Japan. Synerdyne had been the local distributor for California Microdevices for many years, but that company's change of focus and marketing strategy had left a market void in Japan to be filled by Semiconwell. As well as servicing existing accounts, Synerdyne will concentrate on winning new designs in automotive, instrumentation, military, medical and audio applications.
Semiconwell has developed a new line of 9- and 27-channel surface mount LVD resistive networks designed for high-performance active termination of SCSI networks compliant with SPI-2 (Ultra2), SPI-3 (Ultra3) and beyond. Manufactured on ceramic substrates, these devices virtually eliminate channel capacitance and lead inductance, the primary cause of reduced system performance. The LVD SCSI is packaged in a moulded lead frame package (MLP) which offers greater reliability than the exposed resistors of a BGA version. The MLP package is also smaller than BGA, does not require special assembly equipment and is easy to rework and repair at board level. A typical existing BGA version occupies 90,000mil2 of PCB area for every nine channels. The new 20-pin nine-channel device, the SWRSCSI-20ML5, occupies only 25,200mil2 of board area. And the 27-channel, 56-pin SWRSCSI-56ML13 uses only 102,400mil2 of board, compared with 270,000mil2 necessary for three BGA devices.
Semiconwell's integrated isolated zero-ohms jumper array networks can be used in a wide range of applications including as PC board crossovers or permanent jumpers, or to program, customise or alter the functionality of a PC board. Thanks to a very low capacitance between jumpers, these devices can be used also on high-speed data lines. The R0J series solution saves board space, improves PC board performance and reduces assembly cost on passive components. SWR0J devices are available in DIP, SOIC, QSOP, TSSOP packages. SWR0J-3ST is a three-way all-shorted variation of zero-ohm jumpers packaged in a 3-pin SOT23 with two zero-ohms jumpers per package.
09.05.2007 Flip chip spiral chip inductors use bumped gold pads rather than gold wires to reduce parasitic inductance US Microwaves has completed development of the first flip chip spiral chip inductor using bumped gold pads. The flip chip spiral chip inductor is easily mounted by thermocompression or conductive epoxy. The ability to be attached with conductive epoxy opens the possibility of using these high-Q and ultra-high-self-resonance inductors on other substrates than gold-coated thin films on ceramic circuits. Designed and manufactured by US Microwaves in 1990 for military and industrial applications, the spiral chip inductors now can find their place in optoelectronic and wireless consumer products as well. Flip chip spiral inductors eliminate up to 3nH of parasitic inductance associated with the gold wires used for the standard series USMLX3000Q20-xxx and USMLX5000Q20-xxx. Eliminating the parasitic inductance improves inductor performance, self-resonance, precision and operability in the high gigahertz range applications. The fact that the substrate is transparent fused silica is a bonus feature that helps in flip chip mounting operation without sophisticated and expensive equipment. Manufactured with 100% pure gold, the chip does not need any protection and can operate even in hostile environments. Sample quantities are available now. The USMLX3000Q20-xxx and USMLX5000Q20-xxx series are priced at US $1.997 in 100,000-unit quantities and $3.747 in 5000-unit quantities. Production lead-time is 2-4 weeks ARO.
Semiconix Semiconductor designs and manufactures analog devices built on semiconductor linear technology. Semiconix Semiconductor
Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete
components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging
systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military
applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber
optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of
semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays
contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET
s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase
is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic
components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington,
high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes,
TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET
s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE
Labs Provides Wafer Foundry, R&D support and Specialty Wafer Fab Processing (including thin film vacuum deposition
services) to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes:
20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following
fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor
technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete
and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light
wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation,
ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining
by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions
of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions,
gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL
designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications,
industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors,
diodes and schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is supplying integrated
termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet
appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes
networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors.
Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US
MICROWAVES develops, manufactures and supplies high
quality standard microwave thin film circuits and microwave
devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing
from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon
and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications,
MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and
PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.
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